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Digi International Announces Availability of New ConnectCore Module

By Ken Briodagh April 10, 2017

In a recent announcement, Digi International, a global provider of machine-to-machine (M2M) and Internet of Things (IoT) connectivity products and services, has made available its ConnectCore 6UL module platform. The ConnectCore 6UL is designed, the company said, to deliver a secure connected Linux-based NXP i.MX6UL System-on-Module (SOM) with integrated dual-band 802.11ac wireless LAN and Bluetooth 4.2 connectivity in a low-profile surface mount form factor slightly larger than a postage stamp.

“Our intelligent infusion pumps are selected for use by a number of different healthcare providers for various specialized point of care applications,” said Michael Smith, Senior Product Manager, Zyno Medical. “We needed the most advanced wireless component capable of providing the flexibility to create specific, purpose-driven designs to enhance the infusion workflow. It also had to be secure, durable and reliable for our ZynoFlo integrated infusion system.  As such, we are evolving our designs with the latest Digi ConnectCore wireless solutions, which will help us develop devices that meet the unique clinical and operational workflow requirements of users and patients.”

It uses the patent-pending Digi SMTplus hybrid surface mount form factor to provide reliable mounting for high shock/vibration applications and combine design flexibility with ease of manufacturing. The module also incorporates an NXP Kinetis L (Cortex-M0+) microcontroller subsystem and a dedicated secure microcontroller component (Secure Element).

“We have seen tremendous customer interest in a flexible, scalable, power-efficient wireless module with advanced capabilities available in such a compact form factor,” said Mike Rohrmoser, director, product management, embedded systems, Digi International. “The ConnectCore 6UL delivers a secure embedded platform solution for the Industrial Internet of Things. This has led to the design of a truly exciting number of new connected products that are about to come to market.”




Edited by Ken Briodagh

Editorial Director

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