Two heads are always better than one. Make it four heads, and now we’re cooking with gas! Collaboration across the cellular IoT arena is garnering increased interest and even bigger results, and today we learned of a joint effort poised to make robust market impact.
Truphone announced a partnership with Sony Semiconductor Israel, STMicroelectronics and Murata, which today unveiled the general availability of the Type 1SE module.
“By teaming with other industry leaders, we developed a true global connectivity solution that enables customers to realize their IoT products. With unprecedented optimization and flexibility, this module delivers unparalleled size, power, and cost efficiency. Further, the 1SE’s high level of integration drastically decreases and simplifies time to market,” stated Akira Sasaki, General Manager – IoT Group, Murata.
The Type 1SE is highly integrated, miniaturized, low power cellular IoT solution boasting a low power STM32L4 MCU and an ALT1250 M1/NB modem. The module offers each partner to shine, with four core components driving pocket-friendly, accelerated product development.
The 15.4 x 18.0 x 2.5mm solutions brings together the STMicroelectronics’ (News - Alert) ultra-low power STM32L462RE/Arm Cortex-M4 core with 512 kb Flash and 160kb SRAM MCU; Sony’s Alatair ALT1250 solution-based low-power LTE (News - Alert) Cat M1/NB1 modem and integrated SIM and the cherry on top is the preloaded Truphone SIM profile offering global operation.
“At Truphone, we’ve long believed that the better the world connects, the better the world. And we hold that same belief for IoT. The potential for IoT growth is huge, but we cannot get there without seamless connectivity and a global reach. We’re thrilled to be teaming up with some of the best in the industry to bring this to the table for the Type 1SE module,” added Oliver Potter, Director of IoT at Truphone (News - Alert).