Last month (here on IoT Evolution and over on our Industrial IoT News hub), we spent some time talking about Ceva, Inc., provider of innovative silicon and software IP solutions that enable smart edge products to connect and infer data more reliably (and with greater all-around efficiency).
In our past stories, we’ve touched on the company’s portfolio of comprehensive communications and scalable edge AI IP; therein, Ceva is powering some of the most advanced smart edge products in applications involving consumer IoT, mobile, automotive, infrastructure, industrial, and personal computing. Trusted by partners like Sony, Broadcom, Dialog Semiconductor, Nokia, FujiFilm, Samsung, Yamaha and STMicroelectronics (read that specific Ceva/STM story here), Ceva has made waves with its next-gen RivieraWaves Wi-Fi 7 IP platform, its Ceva-NeuPro-Nano NPUs that deliver power, performance and cost efficiencies for semiconductor companies and OEMs to integrate TinyML models into their SoCs, and much more.
And just a couple of days ago, Ceva announced another big-picture win; let’s talk about it, if for a moment.
On Tuesday, Ceva put out a statement; the company reportedly continues to hold its “#1 Position in the Wireless Connectivity IP Market,” according to IPNest’s latest Design IP report, representing a 67% market share of IP revenues in 2023.
Moreover, Ceva’s aforementioned connectivity IP portfolio – encompassing the most adopted standards-based wireless connectivity IPs, including Bluetooth, Wi-Fi, UWB and 802.15.4 – is being seen as the linchpin for Ceva’s foray into other critical IoT applications that demand highly reliable connections, innovative edge AI processing and sensing capabilities.
“Wireless connectivity is a fundamental building block of every smart edge device and forms the basis of our strategy at Ceva to enable any device to connect, sense and infer data more reliably and efficiently,” explained Iri Trashanski, Chief Strategy Officer at Ceva.
“IPNest's latest Design IP Report reinforces our incredible track record of successful implementations of wireless connectivity that powers billions of devices, established through partnerships with many of the world's leading semiconductor companies and OEMs,” Trashanski added. “Our customers rely on our proven and reliable IP to provide secure and high performance connectivity today and in future generations of their products. As the devices we connect become increasingly intelligent, our portfolio of sensing IPs and edge AI NPUs perfectly complement our wireless IPs, and offer our customers a single source and unified approach for their smart edge product roadmaps."
So, the long-story-short of this, readers?
A win’s a win, in layman’s terms, and – as connectivity remains the very lifeblood of the still-expanding Internet of Things – Ceva is setting itself up to for even more successes as the back half of 2024 rounds the corner.
(Editor’s note: For additional market details and forecasts from Ceva, read here.)
Edited by
Greg Tavarez
