Be it here on IoT Evolution or on of our many sister sites like Industrial IoT News and Smart City Sentinel, we’ve had the opportunity to dedicate fair coverage about enterprise-grade IoT products and software provider Telit Cinterion. What is the primary common denominator between each Telit-centric article?
Connectivity.
Well specifically, secure and streamlined hyperconnectivity designed to improve consumers’ lives and redefine IoT business operations for the better. Whether the news involved the company’s deviceWISE AI Visual Inspection tool for manufacturers and operators collecting workstation data, or its “Secure-by-Design” roadmap to ensure that IoT ecosystems remain safe, secure and regulated, the stories all hit that same beat – Telit Cinterion has positioned itself as an IoT pioneer and continues to deliver custom, ready-for-market solutions that help businesses “integrate, activate and operate using actionable intelligence to unlock our world’s potential,” the company has stated.
Today’s article is, as you’d expect having read this far, in that same vein; a next-gen technologies whipped up to accelerate our collective, hyperconnected future.
The long-story-short of it: Telit Cinterion unveiled its FE990B34/40 LGA family of modules, powered by the Snapdragon X72 5G Modem-RF System from Qualcomm Technologies, Inc.
According to Telit Cinterion, this family of modules “redefines connectivity on 5G NR, LTE, and WCDMA, empowering developers to create cutting-edge customer premise equipment (CPE), routers and gateways, even for the most ruggedized applications.”
These new modules feature the following, in terms of technical details and more:
- High-power, quad-core Arm Cortex A55 @ 2.2 GHz baseband processor for optimal computing power
- Snapdragon X72 chipset
- Runs OpenWRT OS with advanced networking features
- A refreshing variety of interfaces for maximum flexibility when integrating peripherals
- 5G sub-6 technology with gigabit LTE and WCDMA support (plus a multi-constellation GNSS receiver)
- Currently available in regional variants; read here for an even deeper solutions overview.
“The FE990B34/40 LGA family of modules, backed by Qualcomm Technologies' advanced 5G X72 and X75 chipset, is emblematic of the tremendous strides being made in 5G connectivity," said Manish Watwani, Chief Marketing and Product Officer at Telit Cinterion. "With unparalleled processing power and versatile interfaces, these new modules embody our dedication to pushing the boundaries of innovation in IoT solutions while empowering developers to create groundbreaking 5G-enabled devices.”
It seems Telit Cinterion will continue offering such innovative IoT modules for bandwidth-intensive applications as more and more businesses demand the capability to create the best-possible user experiences when it comes to responsiveness and coverage. Connectivity is the lifeblood of IoT, after all.
Edited by
Greg Tavarez
